Coolpad Cool S1 Teardown

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Coolpad Cool S1 comes with a 5.50-inch touchscreen display with a resolution of 1080 pixels by 1920 pixels. It is powered by 2.35GHz quad-core Snapdragon 821 processor and it comes with 4GB of RAM. The phone packs 32GB of internal storage cannot be expanded. As far as the cameras are concerned, the Coolpad Cool S1 packs a 16-megapixel primary camera on the rear and a 8-megapixel front shooter for selfies.

The Coolpad Cool S1 runs Android 6.0 and is powered by a 4070mAh non removable battery. It measures 151.40 x 74.70 x 7.50 (height x width x thickness) and weighs 168.00 grams.

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Coolpad Cool S1 with no screw design, the display assembly fixed to the body by glues. Heat up the display edge with a heat gun about 3-5 minutes, and then insert a blade between the display assembly and the body. Slide the blade along the display edge and open the display assembly finally.

Open the display assembly. Be careful, the touch/LCD cable still connecting to the motherboard.

Remove two screws securing the metal sheet and remove it.
Disconnect the touch/LCD cable from the motherboard.

Touch IC is fixed on the touch/LCD cable, which uses a S3320A touch IC from the Synaptics. This touch IC has appeared in Xiaomi Mi note, LeEco Le 2 and other mobile phones.

Although the screen has a serial number, but I find a long time have not found this screen from where, if you know you can leave me a message.

In the next step, we will remove the middle frame.
There is a screw is covering by a fragile stickers. If you damaged it, you will void the warranty.
Remove all screws that securing the middle frame.

Pry up the middle frame with a crowbar and remove it from the phone body.

Remove two screws securing the motherboard.
Disconnect the battery connector, main FPC, coaxial cable and side button cable from the motherboard.

Coolpad Cool S1 comes with a 3.85V, 4070mAh Li-polymer battery, the battery made by SCUD Group Limited.

Disconnect the coaxial cable and the main FPC from the bottom board.
USB Type-C port and vibration modules are on the bottom board.

Qualcomm Snapdragon 821 processor + Samsung 4GB LPDDR4 RAM
Samsung 64GB UFS2.0 ROM
Skyworks 77634-21 RF amplifier (LTE)
Qorvo QM48184 power amplifier

Qualcomm PM8996 power management chip
Qualcomm PMI8996 power management chip
WTR 3925 RF amplifier (GSM)

Qualcomm PMI8996 power management chip

Qualcomm PM8996 power management chip

Qualcomm Snapdragon 821 processor + Samsung 4GB LPDDR4 RAM

16 million pixel main camera, Sony IMX298 sensor

8 million pixel front camera

Power button, volume button

We can see from the dismantling, as a flagship phone, Coolpad Cool S1’s workmanship is quite good. Because the integration level of the board is very high. And some details on the motherboard also have a high standard of Coolpad. However, due to the screen is too thin, a careless may cause the screen scrapped, here is not recommended for users to repair themselves.

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