Meizu E2 runs on Android 6.0 Marshmallow with Flyme OS 6.0 on top and features hybrid dual-SIM slots. It features a 5.5-inch full-HD (1080×1920 pixels) 2.5D curved glass display and 403ppi pixel density. It is powered by a 2.35GHz MediaTek Helio P20 SoC paired with ARM Mali-T880 graphics. Expandable storage is supported via microSD card (up to 128GB).
Meizu E2 sports a 13-megapixel rear sensor with PDAF, and is accompanied by a Quad LED two-colour warm flash light. There is an 8-megapixel front sensor with selfies and video chats. The phone packs a 3400mAh battery with mCharge fast charging technology that promises 40 percent charge in just 30 minutes. Connectivity options include 4G LTE, Wi-Fi, GPS, Bluetooth v4.1 and a Micro-USB port.
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Basically, Meizu mobile phone dismantling methods are similar (in addition to those old MX3, MX2 models), remove the SIM card tray and then remove the screws at the bottom of the fuselage, and then lift up the display from the bottom, and then pry the back cover with a pick.
The sub board is covered with a black plastic bracket. In fact, this is also the loudspeaker module.
Remove the sub board. You can see the mBack button bracket and the metal dome, mBack surrounded by a circle of waterproof rubber.
Meizu E2 with 16nm Helio P20 processor. Helio P20 integrated 8 * A53 core, the highest frequency of 2.3Ghz, GPU was Mali-T880mp2, while the memory is 3GB/4GB LPDDR4X, ROM capacity is 32GB/64GB two specifications.
Meizu E2 dismantling is not difficult, but remove back cover is relatively difficult, it is recommended to use thinner pick and suction sucker.
As for the workmanship, especially in some details such as 3.5mm headset, micro-USB, mBack button has a certain waterproof design. In addition, the most chips on the motherboard are covered with metal shield, effectively prevent the interference between different chips, but unfortunately all shields are single-layer welding, maintenance is more inconvenient.