Sony Xperia XZ Premium was launched in February 2017. The phone comes with a 5.50-inch touchscreen display with a resolution of 2160 pixels by 3840 pixels. The phone is a dual-SIM (GSM and GSM) smartphone that accepts Nano-SIM and Nano-SIM. Connectivity options include Wi-Fi, GPS, Bluetooth, NFC, USB OTG, 3G and 4G.
It is powered by octa-core Qualcomm Snapdragon 835 processor, and it comes with 4GB of RAM. The phone packs 64GB of internal storage that can be expanded up to 256GB via a microSD card. As far as the cameras are concerned, the Sony Xperia XZ Premium packs a 19-megapixel primary camera on the rear and a 13-megapixel front shooter for selfies.
We also take apart the Sony Xperia XZ, click here to see the full teardown.
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Remove the SIM card tray. The phone adopts double card slot design.
A ring of rubber is designed at the card slot.
Since there is no screw on the surface, we try to suck the screen with a suction cup tool, but it is an IP68 waterproof mobile phone after all, and the back cover cannot be easily opened by us.
We use the heat up the back cover with a heat gun. Pry up a little bit with a suction cup, at the same time insert a pick under the back cover.
We have successfully separated the back cover.
A graphite sticker is affixed to the corresponding position of the main board on the back cover.
In the next dismantling we first need to disconnect the battery connector, but because all the connectors are covered with the black plastic cover, so we first remove the screws to fix these covers.
Remove the black plastic cover.
On the back of the black plastic cover, we find that the vibration module is integrated here, using the traditional rotor vibration motor.
Subsequently, the NFC antenna covering the battery is separated.
We continue to remove the top cover screws.
Remove the top cover. Under it, we see the battery connector and the headphone jack connector.
After removing the cover, the motherboard is completely exposed. It can be seen is still very compact.
Disconnect the headphone connector.
When the connectors on the motherboard are disconnected, remove the two screws on the top of the board.
Then we can gently tilt the motherboard and remove it.
Remove the motherboard, the stainless steel roll cage revealed. Compared with the ordinary magnesium aluminum alloy material, this kind of material roll cage can be made thinner under the same strength, but the cost and shaping are more difficult.
Most of the chips are protected by metal shields, but not all.
On the back of the motherboard, you can see that the machine uses two independent slots is because the motherboard’s horizontal space is limited, not like a lot of mobile phones can be designed to carry two cards in a single card slot.
In front of the motherboard near the front of the camera connector, there is a chip, presumably as an image DSP.
Opened the shield, we saw the Samsung UFS 2.1 64GB flash memory, and a chip is blocked by heat grease.
Remove the heat grease. You can see the Samsung 4GB LPDDR4 memory.
Now continue to dismantle the rest of the components, the first is to remove the headset jack module.
In the upper part of the headset module, we see a circle of black foam. They will be sealed with the fuselage seal, so there is greater resistance to disassembly.
Then we separated the main camera from the fuselage. The main camera has 21.2MP, and the model is Sony IMX400, the maximum can shoot 5520*3840 resolution image. CMOS diagonal length of 7.73mm, the size of the amazing 1 / 2.3 inch, a single pixel area of 1.22μm.
The 13MP front camera module
After pulling the glue out, we can easily lift the battery. But should pay attention to this time cannot separate the battery, because the key assembly is also attached to the above, we need to tear it off carefully.
This battery is Sony original battery, 3230mAh, 12.3Wh, made in China.
Remove the four fixing screws.
Then remove the key strip of the gasket.
It can be seen that these keys have been sealed carefully, this seal is different from any other phones on the market. The key module is surrounded by a circle of sealing rubber. They blocked the button hole, was able to achieve waterproof function.
Then remove the speaker screw and remove it and the speaker holes can be found, also designed a ring sealing foam, it stuck to the sound hole position, as the viscosity is lowered after taking out, it is bound to affect the machine’s waterproof effect.
Finally, pull out the bottom data port module. The red rubber at the end of the port is also used to block the hole.