Sharp AQUOS S2 Teardown

Sharp Aquos S2 runs on Android 7.1.1 Nougat and supports a dual-SIM slot. It features a 5.5 inches IPS LCD (Corning Gorilla Glass) 1080 x 2040 display and is powered by the Qualcomm Snapdragon 630/660 octa-core SoC paired with Adreno 512 GPU and 4/6GB of RAM. The phone offers 64GB/128GB of built-in storage.

The Sharp Aquos S2 boasts of a 12MP main snapper at its rear and an 8MP front-facing selfie shooter. There is a Non-removable Li-Ion 3020 mAh battery powering the phone with support for USB Type-C 1.0 reversible connector, USB On-The-Go and Dual SIM (Nano SIM).

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First of all, remove the SIM card tray. The phone supports dual card dual standby, the card tray can put two Dual SIM cards or a TF card.

As the fuselage without any screws, so we use the heat up the back cover with a heat gun.

Pry up a little bit with a suction cup, at the same time insert a pick under the back cover.

Slide the pick to separate the back cover along the edge.

Now the back cover was removed.

The body with a classic three-stage design, the structure is very compact. All connectors are metal plate with screws.

There is no other element on the back cover except the groove of the main camera.

Remove the screws securing the metal plate that securing the battery connector.

Remove the metal plate with a tweezers.

Remove all screws securing the motherboard.
Remove all metal plate and disconnect the connectors.

Disconnect the coaxial cable.

Remove the motherboard.

A black NFC antenna is designed on the metal shield on the front of the motherboard.

Most of the chips on the back of the motherboard are covered by metal shields.

Remove the NFC antenna.

Open the front of the metal shield, you can see the chips on the motherboard, using a very advanced placement process, the density between components is very large.

On the back of the motherboard we found the Qualcomm Snapdragon 630 chips and Samsung’s 64GB flash chips.

After the motherboard removed, the metal roll cage is exposed, the corresponding position of the motherboard is also affixed with copper sheet, but unfortunately the chip did not apply thermal grease, the machine’s overall thermal design is more general.

Remove the screws securing the handset and the front camera.

Remove the metal plate. You can see the front camera and the handset.

Remove the front camera.

Remove the handset.

Remove the rear camera.

Pull out the glue and remove the battery.

Sharp AQUOS S2 comes with a 3.85V, 2930mAh, 11.28Wh Li-polymer, Sharp P/N: HE332. It is manufactured by SCUD (FuJian) Electronis co., LTD.

After separating the battery, we began to remove the screws securing the loudspeaker and remove the loudspeaker.

Below the speaker is the PCB board, we first disconnect the Home key connector.

Remove the vibrating motor.

It can be seen that the type-C port is integrated on the bottom PCB.

Next, I heat the screen through the hot air gun, and then use the same way to dismantle the screen module, this time you can see the corresponding position of the fuselage posted a large area of graphite thermal paste.
The light distance sensor is under the black apron.

At the corresponding position of the screen, we also see the hole of the light sensor. And we found that the screen really dug out from the middle, but did not affect the surrounding pixels display, and had to admire Sharp’s technology.

And then look at the corner, and it really cuts off the corners of the screen.

Look at the bottom of the fuselage, we remove Home key from the screen module.

We find that the smartphone’s screen module hasn’t arranged the driver IC on ribbon cable, which means that screen module need to debug together with the smartphone’s fuselage in the design phase. But ordinary manufacturers can’t do it.

In general, Sharp AQUOS S2 internal workmanship is very good, we see the engineers cleverly arrangements for the handset, the light distance sensor and the front camera, so that they can in a limited space to complete their mission, you Know that this is a full-screen mobile phone has been facing one of the most core design problems, and the phones’s internal structure is very compact, the connectors fixed enough solid, corner thickened can resist strong impact. If there is nothing worthy of improvement, I believe that if the chip uses thermal grease to help heat dissipation, and in the open area to enhance the sealing design will enable this phone’s workmanship rise to a new level.

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